Alumiiniumist substraadi protsessi vool

1. Avamine

Alumiiniumist substraadi tootmisprotsess

1. Materjali - lõikamise protsess

2. Avamise eesmärk

Lõika suures{0}}suuruses sissetulevad materjalid tootmiseks vajaliku suuruseni

3. Ettevaatusabinõud materjalide avamisel

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Puurimine

1. Puurimisprotsess

Tüübel - Puurimine - Kontrollikoda

2. Puurimise eesmärk

Plaadi positsioneerimine ja puurimine, et hõlbustada järgnevat tootmisprotsessi ja kliendi kokkupanekut

3. Ettevaatusabinõud puurimisel

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Teine puur: tööriista auk seadmes pärast jootemaski

3. Kuiva/märja filmi pildistamine

1. Kuiva/märja filmi pildistamise protsess

Lihvimisplaadi - film - säritus - arendus

2. Kuiva/märja filmiga pildistamise eesmärk

Vooluahela tegemiseks vajalikud osad renderdatakse lehel

3. Ettevaatusabinõud kuiva/märja filmiga pildistamiseks

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Happeline/aluseline söövitus

1. Happe/aluseline söövitusprotsess

Söövitus - eemaldamine - kuivatamine - kontrolllaud

2. Happe/aluse söövitamise eesmärk

Pärast kuiva/märja kile pildistamist hoidke vooluringi vajalik osa alles, eemaldage liigne osa väljaspool vooluringi ja pöörake tähelepanu alumiiniumsubstraadi korrosioonile söövituslahuse poolt happesöövitamise ajal;

3. Ettevaatusabinõud happelise/aluselise söövitamise korral

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Viis, siidist jootemask, tegelased

1. Siiditrükk jootmask, iseloomu protsess

Siiditrükk - Eelküpsetamine - Säritus - Arendus - Tegelased

2. Eesmärk siiditrüki joote mask ja tähemärki

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Tähelepanu vajavad asjad siiditrüki jootemaski ja tegelaste jaoks

① To check whether there is garbage or foreign matter on the board

COB alumiiniumist aluspind

COB alumiiniumist aluspind

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-LÕIK, gongilaud

1. V-LÕIK, gongilaua protsess

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-LÕIK, gongilaua eesmärk

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Ettevaatusabinõud V-CUT-i ja gongilaua jaoks

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Seitse, test, OSP

1. Test, OSP protsess

Line Test - Vastupidavus pingetest - OSP

2. Testimine, OSP eesmärk

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, testimine, OSP ettevaatusabinõud

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Kaheksa, FQC, FQA, pakendamine, saatmine

1. Protsess

FQC - FQA - Pakkimine - Saadetis

2. Eesmärk

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Pöörake tähelepanu

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3