Aluminum substrate test project

Experimental conditions

Typical value

thickness

Performance parameters

peel strength

Solder resistance

No layering, no foaming

Dielectric breakdown voltage

Thermal resistance

cooked resistance

Thermal Conductivity

surface resistance

Volume resistance

Dielectric constant

Dielectric loss

Fire resistance

※The above thickness is only the thickness of the adhesive layer, excluding copper foil and copper plate.

structure

Insulation thickness: 75um± percent Conductor thickness: 35um±10 percent

Metal plate thickness: 1.0mm±0.1mm 3

Storage conditions

Aluminum substrates are generally stored in a dark and dry environment. Most aluminum substrates are prone to moisture, yellowing and blackening. Generally, they should be used within 48 hours after opening the vacuum packaging. 3