Current Situation and Development of Multilayer Printed Boards

Since the middle and late 1980s, the output value and output of multi-layer boards have increased by more than 10 percent (compared with the previous year) every year. Due to the rapid development of components to "light, thin, short and small", Multilayer boards are bound to become the most influential and vital category in the printed circuit board industry, and become the leading product. Multilayer board structures will be diversified, thin and high-rise, and MCM-L structure will be faster Development. Multi-layer boards require high investment in equipment and technology. In the future, high-level multi-layer boards will be developed and produced in large PCB factories with strong strength

The development trend of multi-layer boards in the future:

high density

Thin multi (high) stratification

Diversification of multi-layer board structures

Thin base material for high performance thin copper foil

High surface flatness and surface coating technology

Flexible Multilayer Boards and Rigid-Flex Multilayer Boards